GIKI, Topi, Pakistan | December 02-04, 2025
conference program
keynote speakers
Click on a picture to view talk abstract.
Ian Ferguson, Ph.D.,
Fellow of AVS, IEEE, IOP,
OSA, SPIE and CPhys
Fellow of AVS, IEEE, IOP,
OSA, SPIE and CPhys
Mohammed Shahidehpour, Ph.D,
Fellow IEEE
Fellow IEEE
James Won Ki Hong, Ph.D
Kamal Alameh, Ph.D
Ashfaq A. Khokhar, Ph.D
Ali Imran, Ph.D
Katharina Krombholz, Ph.D
Khizer Bhutta, Ph.D
Online
Title: Enabling Materials for Quantum Information at Room Temperature
Dr. Ian Ferguson
Professor, Department of Electrical and Computer Engineering
FRSA - Fellow of AVS, IEEE, IOP, OSA, SPIE and CPhys
Southern Polytechnic College of Engineering and Engineering Technology, Kennesaw State University, Marietta, GA 30060, USA
Co-authors: S M Atiqur Rahman, Oded Ravid, Vishal Saravade, Manika Tun Nafisa, Zhe Chuan Feng, Na Lu, Benjamin Klein, and Ian Ferguson
Professor, Department of Electrical and Computer Engineering
FRSA - Fellow of AVS, IEEE, IOP, OSA, SPIE and CPhys
Southern Polytechnic College of Engineering and Engineering Technology, Kennesaw State University, Marietta, GA 30060, USA
Co-authors: S M Atiqur Rahman, Oded Ravid, Vishal Saravade, Manika Tun Nafisa, Zhe Chuan Feng, Na Lu, Benjamin Klein, and Ian Ferguson
Abstract:
There is an increasing interest in materials for future computing needs, which are not met using conventional electronics. Quantum Information (QI) could enhance the functionalities, storage capabilities, and data manipulation and transmission for the next generation of devices. Spintronics is an enabling technology that meets the speed, power, and scalability requirements for quantum information. Spin of a material is directly related to magnetic, electrical, and optical properties. However, most materials show conducive properties for spintronics only at cryogenic temperatures, which limits their practical applications. There is a need to investigate spintronic materials for these applications at room temperature (RT).
There is an increasing interest in materials for future computing needs, which are not met using conventional electronics. Quantum Information (QI) could enhance the functionalities, storage capabilities, and data manipulation and transmission for the next generation of devices. Spintronics is an enabling technology that meets the speed, power, and scalability requirements for quantum information. Spin of a material is directly related to magnetic, electrical, and optical properties. However, most materials show conducive properties for spintronics only at cryogenic temperatures, which limits their practical applications. There is a need to investigate spintronic materials for these applications at room temperature (RT).
Dr. Ian Ferguson
This paper will provide an overview to show the potential of wide bandgap semiconductor materials as an emerging technology for quantum information. One such material system is the III-Nitrides, and, for example, GaN doped with transition metal or rare earth elements has the potential for controllable spin and charge for spintronics at RT. Gadolinium-doped GaN grown using MOCVD has been shown to have ferromagnetism at RT that is intrinsic and free-carrier mediated. However, only GaGdN grown using a precursor, which contains oxygen in its organic ligand that is incorporated in the GaGdN exhibited ferromagnetism. Magnetic, structural, and electrical properties of GaGdN grown with different chemistries and implanted with O or C are investigated in this work in order to gain a better understanding of the origin of ferromagnetism in GaGdN. Another approach is the use of II-VI semiconductor materials such as ZnO, which will also be reviewed. ZnO-based materials have an additional advantage that they are both earth-abundant and non-toxic. Understanding the RT ferromagnetism mechanism in these materials is essential to control the spin and build practical spintronic devices for Quantum Information applications at Room Temperature (QI@RT).
Speaker Biography:
Ian Ferguson is the former Dean of Southern Polytechnic College of Engineering and Engineering Technology at Kennesaw State University. His research expertise is in compound semiconductor materials and devices for sensors, illumination, energy harvesting, and spintronics applications. He is an international educator and researcher with over 575 refereed journal publications, conference proceedings, books, book chapters, and patents. He is a Fellow of the Royal Society of Arts, Manufactures and Commerce (FRSA), the American Vacuum Society, the Institute of Electrical and Electronic Engineering, the Institute of Physics, Optica, the International Society for Optical Engineering, and a Chartered Physicist.
Ian Ferguson is the former Dean of Southern Polytechnic College of Engineering and Engineering Technology at Kennesaw State University. His research expertise is in compound semiconductor materials and devices for sensors, illumination, energy harvesting, and spintronics applications. He is an international educator and researcher with over 575 refereed journal publications, conference proceedings, books, book chapters, and patents. He is a Fellow of the Royal Society of Arts, Manufactures and Commerce (FRSA), the American Vacuum Society, the Institute of Electrical and Electronic Engineering, the Institute of Physics, Optica, the International Society for Optical Engineering, and a Chartered Physicist.
Online
Title: Hierarchical control and operation of locally distributed energy resources for enhancing the bulk power grid reliability, resilience, security, and economics
Dr. Mohammed Shahidehpour
Fellow IEEE
Professor and Director
Robert W. Galvin Center for Electricity Innovation
Illinois Institute of Technology
Chicago, IL, USA
Fellow IEEE
Professor and Director
Robert W. Galvin Center for Electricity Innovation
Illinois Institute of Technology
Chicago, IL, USA
Abstract:
This technical presentation establishes a comprehensive foundation for a practical implementation of hierarchical ISO/DSO coordination mechanism that systematically unlock the full potential of local DERs and BTM resources in wholesale electricity markets. The proposed ISO/DSO coordination framework achieves an efficient integration of DERs by systematically transforming millions of small, variable, and distributed behind-the-meter resources into reliable, dispatchable market participants through VPP aggregation and DSO market mechanisms.
This technical presentation establishes a comprehensive foundation for a practical implementation of hierarchical ISO/DSO coordination mechanism that systematically unlock the full potential of local DERs and BTM resources in wholesale electricity markets. The proposed ISO/DSO coordination framework achieves an efficient integration of DERs by systematically transforming millions of small, variable, and distributed behind-the-meter resources into reliable, dispatchable market participants through VPP aggregation and DSO market mechanisms.
Dr. Mohammed Shahidehpour
This transformation directly enables seamless participation of DERs in wholesale electricity markets while preserving the computational efficiency and operational procedures that grid operators would require for system-wide optimization. The resulting integration of DSO creates a foundation for addressing the volatility of LMPs as one of the most pressing operational challenges in modern power systems. The successful integration work will enable the development of standardized protocols and market rules for hierarchical coordination, facilitating broader industry adoption while ensuring consistent implementation across different ISO and DSO jurisdictions. The presentation will discuss the DSO models and constructs and present the results for the ISO/DSO framework's performance under extreme operating conditions. The technical feasibility demonstrated in this presentation combined with substantial economic benefits provides compelling evidence for the coordination of ISO/DSO as a solution to the growing challenges of high renewable energy penetration and distributed resource proliferation throughout the world.
Speaker Biography:
Biography - Dr. Mohammad Shahidehpour is a University Distinguished Professor and Galvin Chair Professor in the Electrical and Computer Engineering Department at Illinois Institute of Technology (IIT). He also serves as the Director of the Robert W. Galvin Center for Electricity Innovation at IIT. He has over 45 years of experience with power system operation, planning, and control and has completed several major projects for the electric energy sector. His project on Perfect Power Systems has converted the entire IIT Campus to an islandable microgrid. Dr. Shahidehpour was the recipient of several technical awards including of the IEEE Burke Hayes Award for his research on hydrokinetics, IEEE/PES Outstanding Power Engineering Educator Award, IEEE/PES Ramakumar Family Renewable Energy Excellence Award, IEEE/PES Douglas M. Staszesky Distribution Automation Award, and the Edison Electric Institute's Power Engineering Educator Award. He has co-authored 6 books and over 1000 technical papers on electric power system operation and planning, and served as the founding Editor-in-Chief of the IEEE Transactions on Smart Grid. Dr. Shahidehpour is the recipient of the 2009 honorary doctorate from the Polytechnic University of Bucharest. He is a Fellow of IEEE, Chinese Society of Electric Engineers (CSEE), American Association for the Advancement of Science (AAAS), and National Academy of Inventors (NAI). He is an academician of the US National Academy of Engineering (NAE). He is also listed as a highly cited researcher on the Web of Science (ranked in the top 1% by citations demonstrating significant influence among his peers).
Biography - Dr. Mohammad Shahidehpour is a University Distinguished Professor and Galvin Chair Professor in the Electrical and Computer Engineering Department at Illinois Institute of Technology (IIT). He also serves as the Director of the Robert W. Galvin Center for Electricity Innovation at IIT. He has over 45 years of experience with power system operation, planning, and control and has completed several major projects for the electric energy sector. His project on Perfect Power Systems has converted the entire IIT Campus to an islandable microgrid. Dr. Shahidehpour was the recipient of several technical awards including of the IEEE Burke Hayes Award for his research on hydrokinetics, IEEE/PES Outstanding Power Engineering Educator Award, IEEE/PES Ramakumar Family Renewable Energy Excellence Award, IEEE/PES Douglas M. Staszesky Distribution Automation Award, and the Edison Electric Institute's Power Engineering Educator Award. He has co-authored 6 books and over 1000 technical papers on electric power system operation and planning, and served as the founding Editor-in-Chief of the IEEE Transactions on Smart Grid. Dr. Shahidehpour is the recipient of the 2009 honorary doctorate from the Polytechnic University of Bucharest. He is a Fellow of IEEE, Chinese Society of Electric Engineers (CSEE), American Association for the Advancement of Science (AAAS), and National Academy of Inventors (NAI). He is an academician of the US National Academy of Engineering (NAE). He is also listed as a highly cited researcher on the Web of Science (ranked in the top 1% by citations demonstrating significant influence among his peers).
Title: AI-Driven Innovations: Leveraging Large Language Models for Softwarized Network Management, Spine Disease Detection, and Academic Excellence
Dr. James Won Ki Hong
Professor,
Department of Computer Science and Engineering,
Pohang University of Science and Technology (POSTECH),
Pohang, Korea
Professor,
Department of Computer Science and Engineering,
Pohang University of Science and Technology (POSTECH),
Pohang, Korea
Abstract:
In this keynote, we explore the transformative potential of Artificial Intelligence, particularly Large Language Models (LLMs), across diverse domains such as network management, medical diagnostics, and academic peer review. We delve into how LLMs are revolutionizing network management by detecting faults in network devices and virtual network functions, and automating virtual network configurations. In healthcare, we examine their role in detecting causes of spine pain through advanced pattern recognition and data analysis. Finally, we discuss the application of LLMs in technical paper reviewing, where they assist in ensuring quality, originality, and relevance in academic research.
In this keynote, we explore the transformative potential of Artificial Intelligence, particularly Large Language Models (LLMs), across diverse domains such as network management, medical diagnostics, and academic peer review. We delve into how LLMs are revolutionizing network management by detecting faults in network devices and virtual network functions, and automating virtual network configurations. In healthcare, we examine their role in detecting causes of spine pain through advanced pattern recognition and data analysis. Finally, we discuss the application of LLMs in technical paper reviewing, where they assist in ensuring quality, originality, and relevance in academic research.
Dr. James Won Ki Hong
In this keynote, we explore the transformative potential of Artificial Intelligence, particularly Large Language Models (LLMs), across diverse domains such as network management, medical diagnostics, and academic peer review. We delve into how LLMs are revolutionizing network management by detecting faults in network devices and virtual network functions, and automating virtual network configurations. In healthcare, we examine their role in detecting causes of spine pain through advanced pattern recognition and data analysis. Finally, we discuss the application of LLMs in technical paper reviewing, where they assist in ensuring quality, originality, and relevance in academic research.
Speaker Biography:
James Won-Ki Hong is Professor in the Dept. of Computer Science and Engineering (http://cse.postech.ac.kr), Director of Center for Crypto Blockchain Research (http://ccbr.postech.ac.kr), and Director of Distributed Processing and Network Management Lab (http://dpnm.postech.ac.kr/) at POSTECH, Pohang, Korea. James worked as CTO and Senior Executive Vice President for KT from March 2012 to Feb. 2014, where he was responsible for leading the R&D effort of KT and its 50 subsidiary companies, and where he initiated R&D on SDN (Software-Defined Networking). He was Chairman of National Intelligence Communication Enterprise Association, and Chairman of Telecommunications Technology Association (TTA) Standardization Board in Korea. He was a co-founder and Executive Director of SDN/NFV Forum from Oct. 2014 to May 2019 in Korea (https://www.sdnnfv.org/). He was a co-founder and chief technical advisor of Kedutech, a Korean startup developing and providing video conferencing service called Vmeeting (https://vmeeting.io). He was co-founder and CTO of Netstech, a Palo Alto, USA-based startup developing network integrated ultra-dense, blade servers from 2000 to 2002. His research interests include blockchain & cryptocurrency, AI-based network management, SDN and NFV, and LLM-based applications.
Over the past 30 years, James has been an active volunteer in various committees in IEEE, ComSoc, and KICS. He has served as Steering Committee Chair of IEEE ICBC, NOMS, IM, NetSoft, APNOMS and CNSM as well as Chair of CNOM and KNOM. He has also been serving as Editor-in-Chief of Wiley’s International Journal of Network Management (IJNM, https://onlinelibrary.wiley.com/journal/10991190) as well as an editorial board member of IEEE TNSM, JNSM and JCN. He was General Co-Chair of IEEE ICBC 2025 (http://icbc2025.ieee-icbc.org/). He was General Chair of IEEE NOMS 2024 (http://noms2024.ieee-noms.org), NetSoft 2016 (http://sites.ieee.org/netsoft-2016/), IEEE ICBC 2019 (http://icbc2019.ieee-icbc.org/), IEEE NOMS 2018 (http://noms2018.ieee-noms.org) and 2018 IEEE Blockchain Summit Korea.
James received his HBSc and MSc degrees in Computer Science from the University of Western Ontario, Canada in 1983 and 1985, respectively, and the PhD degree in Computer Science from the University of Waterloo, Canada in 1991.
James Won-Ki Hong is Professor in the Dept. of Computer Science and Engineering (http://cse.postech.ac.kr), Director of Center for Crypto Blockchain Research (http://ccbr.postech.ac.kr), and Director of Distributed Processing and Network Management Lab (http://dpnm.postech.ac.kr/) at POSTECH, Pohang, Korea. James worked as CTO and Senior Executive Vice President for KT from March 2012 to Feb. 2014, where he was responsible for leading the R&D effort of KT and its 50 subsidiary companies, and where he initiated R&D on SDN (Software-Defined Networking). He was Chairman of National Intelligence Communication Enterprise Association, and Chairman of Telecommunications Technology Association (TTA) Standardization Board in Korea. He was a co-founder and Executive Director of SDN/NFV Forum from Oct. 2014 to May 2019 in Korea (https://www.sdnnfv.org/). He was a co-founder and chief technical advisor of Kedutech, a Korean startup developing and providing video conferencing service called Vmeeting (https://vmeeting.io). He was co-founder and CTO of Netstech, a Palo Alto, USA-based startup developing network integrated ultra-dense, blade servers from 2000 to 2002. His research interests include blockchain & cryptocurrency, AI-based network management, SDN and NFV, and LLM-based applications.
Over the past 30 years, James has been an active volunteer in various committees in IEEE, ComSoc, and KICS. He has served as Steering Committee Chair of IEEE ICBC, NOMS, IM, NetSoft, APNOMS and CNSM as well as Chair of CNOM and KNOM. He has also been serving as Editor-in-Chief of Wiley’s International Journal of Network Management (IJNM, https://onlinelibrary.wiley.com/journal/10991190) as well as an editorial board member of IEEE TNSM, JNSM and JCN. He was General Co-Chair of IEEE ICBC 2025 (http://icbc2025.ieee-icbc.org/). He was General Chair of IEEE NOMS 2024 (http://noms2024.ieee-noms.org), NetSoft 2016 (http://sites.ieee.org/netsoft-2016/), IEEE ICBC 2019 (http://icbc2019.ieee-icbc.org/), IEEE NOMS 2018 (http://noms2018.ieee-noms.org) and 2018 IEEE Blockchain Summit Korea.
James received his HBSc and MSc degrees in Computer Science from the University of Western Ontario, Canada in 1983 and 1985, respectively, and the PhD degree in Computer Science from the University of Waterloo, Canada in 1991.
Online
Title: Building Integrated Photovoltaic (BIPV) Systems for future zero-net-energy buildings
Dr. Kamal Alameh
Professor,
World Class University (WCU)
Gwangju Institute of Science and Technology (GIST),
Korea
Professor,
World Class University (WCU)
Gwangju Institute of Science and Technology (GIST),
Korea
Abstract:
Buildings consume around 40% of the energy produced globally, thus contributing more than 40% of all greenhouse gas (GHG) emissions. Therefore, decreasing building energy consumption and reliance on fossil-fuel-based energy is crucial for reducing the negative effects on the environment. The majority of current Solar PV systems are roof-mounted. A high-rise building typically has a limited roof area; hence, the net energy production of roof mounted PV systems is typically insufficient for self-sustainability.
Buildings consume around 40% of the energy produced globally, thus contributing more than 40% of all greenhouse gas (GHG) emissions. Therefore, decreasing building energy consumption and reliance on fossil-fuel-based energy is crucial for reducing the negative effects on the environment. The majority of current Solar PV systems are roof-mounted. A high-rise building typically has a limited roof area; hence, the net energy production of roof mounted PV systems is typically insufficient for self-sustainability.
Dr. Kamal Alameh
In this talk, we introduce innovative Building-Integrated Photovoltaics (BIPV) modules developed by Alpha Solar Tech., which mimic conventional building materials, such as brick, wood panels, marble, granite, sandstones and tinted glass. These BIPV modules have the potential to convert high-rise buildings and urban infrastructures into stylish sustainable solar farms, thus enabling on-site clean energy generation, improving building sustainability ratings, decreasing carbon footprint and creating cost-savings.
Speaker Biography:
Professor Kamal Alameh previously worked as Director of Electron Science Research Institute and Director of WA Centre of Excellence for Micro Photonic Systems at Edith Cowan University (ECU). He is a world- renowned expert in optics and Nano-Photonics, having worked as a Professor in the World Class University (WCU) Gwangju Institute of Science and Technology (GIST), Korea. He is currently Adjunct Professor with the University of Melbourne, KCST-Kuwait and holds the position as lifetime guest Professor with Southeast University in Nanjing, China. Currently, he is the Chief Technical Officer of the WA startup company Alpha Solar Tech., working on the development of Building-Integrated Photovoltaic (BIPV) Systems that can be integrated directly into buildings and construction structures in place of ordinary building materials for on-site clean energy generation.
Professor Kamal Alameh previously worked as Director of Electron Science Research Institute and Director of WA Centre of Excellence for Micro Photonic Systems at Edith Cowan University (ECU). He is a world- renowned expert in optics and Nano-Photonics, having worked as a Professor in the World Class University (WCU) Gwangju Institute of Science and Technology (GIST), Korea. He is currently Adjunct Professor with the University of Melbourne, KCST-Kuwait and holds the position as lifetime guest Professor with Southeast University in Nanjing, China. Currently, he is the Chief Technical Officer of the WA startup company Alpha Solar Tech., working on the development of Building-Integrated Photovoltaic (BIPV) Systems that can be integrated directly into buildings and construction structures in place of ordinary building materials for on-site clean energy generation.
Title: Quantum Computing—A Systems Perspective
Dr. Ashfaq A. Khokhar
Professor and Palmer Dept. Chair,
Electrical and Computer Engineering
Iowa State University
USA
Professor and Palmer Dept. Chair,
Electrical and Computer Engineering
Iowa State University
USA
Abstract:
Quantum computing is rapidly evolving from theoretical promise to practical reality, yet its path is shaped by the intricate interplay of hardware limitations, algorithmic complexity, and engineering constraints. This talk presents a systems-level perspective on quantum computing, emphasizing the need for holistic approaches that span quantum algorithm design, software engineering, compiler development, and performance evaluation.
Quantum computing is rapidly evolving from theoretical promise to practical reality, yet its path is shaped by the intricate interplay of hardware limitations, algorithmic complexity, and engineering constraints. This talk presents a systems-level perspective on quantum computing, emphasizing the need for holistic approaches that span quantum algorithm design, software engineering, compiler development, and performance evaluation.
Dr. Ashfaq A. Khokhar
Quantum computing is rapidly evolving from theoretical promise to practical reality, yet its path is shaped by the intricate interplay of hardware limitations, algorithmic complexity, and engineering constraints. This talk presents a systems-level perspective on quantum computing, emphasizing the need for holistic approaches that span quantum algorithm design, software engineering, compiler development, and performance evaluation.
Speaker Biography:
Dr. Ashfaq Khokhar has an illustrative academic and entrepreneurship career that spans over 30 years. Since 2017, he is serving as Professor and Palmer Department Chair of Electrical and Computer Engineering at Iowa State University. Dr. Khokhar was previously Chair of the Department of Electrical and Computer Engineering at Illinois Institute of Technology (2013-2016). Before that, he was a Professor and Director of Graduate Studies in the Department of Electrical and Computer Engineering at the University of Illinois at Chicago. Khokhar was named as Fellow of the Institute of Electrical and Electronics Engineer (IEEE) in 2009. He is also the recipient of NSF Career Award and numerous best paper awards.He has founded two startup companies: Cloud Health Solutions and Video Analytics, where he serves as the Founding Partner and Chief Technology Officer (CTO).
Dr. Khokhar’s current research is focused on health care and machine learning. He is also considered a leading expert in the area of high-performance solutions for multimedia applications, especially those that are data or communication intensive. He has published over 400 papers in peer reviewed journals and conferences. His research has been supported by the National Science Foundation, the National Institutes of Health, the United States Army, the Department of Homeland Security and the Air Force Office of Scientific Research.
Dr. Khokhar earned his bachelor’s degree in electrical engineering from the University of Engineering and Technology in Lahore, Pakistan; his master’s degree in computer engineering from Syracuse University; and his Ph.D. in computer engineering from the University of Southern California.
Dr. Ashfaq Khokhar has an illustrative academic and entrepreneurship career that spans over 30 years. Since 2017, he is serving as Professor and Palmer Department Chair of Electrical and Computer Engineering at Iowa State University. Dr. Khokhar was previously Chair of the Department of Electrical and Computer Engineering at Illinois Institute of Technology (2013-2016). Before that, he was a Professor and Director of Graduate Studies in the Department of Electrical and Computer Engineering at the University of Illinois at Chicago. Khokhar was named as Fellow of the Institute of Electrical and Electronics Engineer (IEEE) in 2009. He is also the recipient of NSF Career Award and numerous best paper awards.He has founded two startup companies: Cloud Health Solutions and Video Analytics, where he serves as the Founding Partner and Chief Technology Officer (CTO).
Dr. Khokhar’s current research is focused on health care and machine learning. He is also considered a leading expert in the area of high-performance solutions for multimedia applications, especially those that are data or communication intensive. He has published over 400 papers in peer reviewed journals and conferences. His research has been supported by the National Science Foundation, the National Institutes of Health, the United States Army, the Department of Homeland Security and the Air Force Office of Scientific Research.
Dr. Khokhar earned his bachelor’s degree in electrical engineering from the University of Engineering and Technology in Lahore, Pakistan; his master’s degree in computer engineering from Syracuse University; and his Ph.D. in computer engineering from the University of Southern California.
Title: Technology for Digital Inclusion: connecting the unconnected
Dr. Ali Imran
Professor,
Head, James Watt School of Engineering,
University of Glasgow
UK
Professor,
Head, James Watt School of Engineering,
University of Glasgow
UK
Abstract:
Despite unprecedented advances in digital technology, nearly one-third of the world’s population remains unconnected, excluded from the economic, educational, and social benefits of the digital age. Bridging this divide requires more than expanding coverage—it demands rethinking how we design, deploy, and sustain technology for inclusion. This keynote will explore innovative pathways toward frugal, energy-efficient, and open communication systems that can empower marginalized communities and enable equitable access to digital opportunities. Drawing on lessons from global connectivity initiatives and advances in 6G, AI, and edge computing, the talk will highlight how technology can become a true enabler of inclusion—connecting not just devices, but people, societies, and futures.
Despite unprecedented advances in digital technology, nearly one-third of the world’s population remains unconnected, excluded from the economic, educational, and social benefits of the digital age. Bridging this divide requires more than expanding coverage—it demands rethinking how we design, deploy, and sustain technology for inclusion. This keynote will explore innovative pathways toward frugal, energy-efficient, and open communication systems that can empower marginalized communities and enable equitable access to digital opportunities. Drawing on lessons from global connectivity initiatives and advances in 6G, AI, and edge computing, the talk will highlight how technology can become a true enabler of inclusion—connecting not just devices, but people, societies, and futures.
Dr. Ali Imran
Speaker Biography:
Professor Muhammad Ali Imran, Fellow IEEE, Fellow IET, Fellow RSE and many other prestigious bodies (EAI, IAAI, HEA) is a globally recognized expert in wireless communication systems. He graduated from Imperial College London with MSc Distinction and PhD. He is the Head of James Watt School of Engineering and also leads Communications Sensing and Imaging research hub of over 100 researchers in areas ranging from advanced wireless technologies to energy-efficient communications. Prof. Imran and his team, spearhead global advancements in the area of communication systems. His pioneering contributions in self-organized cellular networks and energy-efficient communications are widely cited and adapted in standards. Leading a prominent transnational education initiative, he represents Scottish Higher Education internationally. With over 25 years of academic and industry expertise, he holds pivotal roles in multi-million-pound projects and technical bodies at international level. Additionally, is a consultant for international projects, fora, and industrial firms on self-organized networks and 5G/6G technology applications.
Professor Muhammad Ali Imran, Fellow IEEE, Fellow IET, Fellow RSE and many other prestigious bodies (EAI, IAAI, HEA) is a globally recognized expert in wireless communication systems. He graduated from Imperial College London with MSc Distinction and PhD. He is the Head of James Watt School of Engineering and also leads Communications Sensing and Imaging research hub of over 100 researchers in areas ranging from advanced wireless technologies to energy-efficient communications. Prof. Imran and his team, spearhead global advancements in the area of communication systems. His pioneering contributions in self-organized cellular networks and energy-efficient communications are widely cited and adapted in standards. Leading a prominent transnational education initiative, he represents Scottish Higher Education internationally. With over 25 years of academic and industry expertise, he holds pivotal roles in multi-million-pound projects and technical bodies at international level. Additionally, is a consultant for international projects, fora, and industrial firms on self-organized networks and 5G/6G technology applications.
Title: Security and Privacy for Everyone
Dr. Katharina Krombholz
CISPA Helmholtz Center for Information Security in
Saarbrücken, Germany
CISPA Helmholtz Center for Information Security in
Saarbrücken, Germany
Abstract:
The Internet often mirrors physical world inequalities, leaving certain groups marginalized and even more vulnerable to security threats and privacy violations. In this talk, I present how I address this global societal challenge to ensure that online services and the Internet of Things are secure, privacy-preserving and more accessible for everyone. I will first talk about methodological challenges of human-centric security research with an emphasis on marginalized populations. Second, I will present results and lessons-learned from our recently conducted studies including research with illiterate Internet users in Pakistan and blind and low-vision users from Germany. To conclude my talk, I will showcase CIRCLE, a bridge-building research initiative to foster interdisciplinary, cross-borders research on making the Internet a safer place for everyone.
The Internet often mirrors physical world inequalities, leaving certain groups marginalized and even more vulnerable to security threats and privacy violations. In this talk, I present how I address this global societal challenge to ensure that online services and the Internet of Things are secure, privacy-preserving and more accessible for everyone. I will first talk about methodological challenges of human-centric security research with an emphasis on marginalized populations. Second, I will present results and lessons-learned from our recently conducted studies including research with illiterate Internet users in Pakistan and blind and low-vision users from Germany. To conclude my talk, I will showcase CIRCLE, a bridge-building research initiative to foster interdisciplinary, cross-borders research on making the Internet a safer place for everyone.
Dr. Katharina Krombholz
Speaker Biography:
Katharina Krombholz is tenured faculty at the CISPA Helmholtz Center for Information Security in Saarbrücken, Germany where she leads the Usable Security Research Group. She holds a PhD from TU Wien and has a permanent visiting faculty position at Lahore in Pakistan. She is interested in interdisciplinary, human-centric security and privacy research and publishes at both the top Human-Computer Interaction and Security & Privacy venues.
Katharina Krombholz is tenured faculty at the CISPA Helmholtz Center for Information Security in Saarbrücken, Germany where she leads the Usable Security Research Group. She holds a PhD from TU Wien and has a permanent visiting faculty position at Lahore in Pakistan. She is interested in interdisciplinary, human-centric security and privacy research and publishes at both the top Human-Computer Interaction and Security & Privacy venues.
Title: Enabling the AI Revolution ⎼ Advancing Hybrid Packaging Technology for Next Generation Multi-Die Systems for AI-Chip Manufacturing
Dr. Khizar M. Bhutta
Program Leader – Manufacturing & Apprenticeship Solutions
Kinexus Group, Benton Harbor, Michigan, USA
Program Leader – Manufacturing & Apprenticeship Solutions
Kinexus Group, Benton Harbor, Michigan, USA
Abstract:
Hybrid packaging is fundamentally transforming the semiconductor industry, driven by the rapidly escalating demands of next-generation artificial intelligence (AI) chips. This invited keynote address will examine the pivotal role of advanced packaging technologies in addressing the limitations of conventional chip fabrication, thereby unlocking unprecedented levels of performance, integration, and functionality. The talk will first revisit the evolution from traditional packaging technology originally developed for high-power microelectronics applications such as WBG deep-UV photonic engines and high power modular electronics to today’s state-of-the-art hybrid bonding paradigm. The presentation will delve into the technical underpinnings of flip chip packaging technology, with an emphasis on the direct die-to-substrate interconnection via solder bump arrays, shortens interconnect paths, thereby reducing parasitic inductance and capacitance, mitigating signal propagation delays, and enhancing high-frequency signal integrity, capabilities essential to meeting the bandwidth and latency demands of AI-accelerated computing workloads. Its direct thermal path enables efficient heat dissipation, essential for managing the elevated power densities of AI processors.
Hybrid packaging is fundamentally transforming the semiconductor industry, driven by the rapidly escalating demands of next-generation artificial intelligence (AI) chips. This invited keynote address will examine the pivotal role of advanced packaging technologies in addressing the limitations of conventional chip fabrication, thereby unlocking unprecedented levels of performance, integration, and functionality. The talk will first revisit the evolution from traditional packaging technology originally developed for high-power microelectronics applications such as WBG deep-UV photonic engines and high power modular electronics to today’s state-of-the-art hybrid bonding paradigm. The presentation will delve into the technical underpinnings of flip chip packaging technology, with an emphasis on the direct die-to-substrate interconnection via solder bump arrays, shortens interconnect paths, thereby reducing parasitic inductance and capacitance, mitigating signal propagation delays, and enhancing high-frequency signal integrity, capabilities essential to meeting the bandwidth and latency demands of AI-accelerated computing workloads. Its direct thermal path enables efficient heat dissipation, essential for managing the elevated power densities of AI processors.
Dr. Khizer Bhutta
Furthermore, flip chip packaging supports high I/O density for massive data throughput, with underfill materials enhancing long-term reliability by mitigating thermal and mechanical stresses on solder joints. The transition to hybrid flip-chip bonding enables ultra-fine interconnect pitches of 10 μm and below, a critical enabler for high-density, multi-die integration in modern AI systems. The presentation will explore recent innovations in hybrid packaging highlighting strategies for multi-die integration. Various architectural approaches for die stacking and co-location within a single package will be discussed, with emphasis on optimizing performance, power efficiency, and system-level form factor. Particular attention will be given to 2.5D and 3D multi-die packaging, where Through-Silicon Vias (TSVs) enable vertical and lateral integration of multiple dies, enhancing bandwidth, reducing power consumption, and minimizing footprint through dense chiplet integration on shared substrates or within vertically stacked configurations. This keynote will also address the challenges in advanced TSV packaging, including cost structures, thermal management, and process complexity. Ongoing R&D from leading industry and academic institutions will be highlighted, underscoring global advancements in micro- and nanoelectronics packaging integration and scaling. Finally, the presentation will highlight how AI is actively shaping packaging development itself through AI-driven co-optimization for chiplet placement and interconnect routing, and applications such as machine learning for enhanced process control in multi-die advanced flip-chip and hybrid bonding techniques. Attendees will leave with a comprehensive perspective on how hybrid packaging is enabling the future of AI hardware from cloud-scale datacenter accelerators to energy-efficient edge inference systems and how AI, in turn, is accelerating progress in the packaging domain.
Speaker Biography:
Driving innovation at the nexus of advanced manufacturing and emerging semiconductor technologies, Dr. Khizar M. Bhutta is a distinguished Innovation Director with over 15 years of experience spanning corporate R&D, high-tech manufacturing, and academic research. He has led complex, cross-sector initiatives that deliver scalable technologies, accelerate digital transformation, and strengthen industrial competitiveness.
Renowned for bridging strategic vision with deep technical execution, Dr. Khizar has consistently translated cutting-edge science into market-ready solutions advancing organizational growth and fostering innovation ecosystems across public-private partnerships. His core expertise includes innovation engineering, new product development, high-volume manufacturing, and large-scale program leadership. As Manufacturing and Apprenticeship Solution Program Leader at Kinexus Group, Dr. Bhutta drives Industry 4.0 integration by aligning emerging digital technologies with modern manufacturing practices. In collaboration with the Michigan Manufacturing Technology Center, Tooling U-SME, and Nanoridge Materials, he leads national efforts to expand smart manufacturing adoption and cultivate a sustainable semiconductor talent pipeline through innovative apprenticeship models. Dr. Khizar’s technical portfolio spans tactile and disruptive innovation, additive manufacturing, intellectual property strategy, and consumer-driven product design. He partners closely with C-suite leadership to convert complex capabilities into measurable business value. His innovations include micro- and nanoelectronic semiconductor devices, silicon photonics, wide bandgap semiconductors for AI-integrated sensing, functional nanomaterials, cold plasma therapeutics, and circular economy solutions for advanced manufacturing.
Earlier in his career, he launched several high-impact R&D programs, including the development of a high-purity germanium detector research facility at the University of South Dakota in partnership with The Sanford Underground Research Facility, and The Lawrence Berkeley National Laboratory, CA. He also served as Research Professor at the Center for Optoelectronics and Optical Communications at UNC Charlotte, and began his career in Silicon Valley as Lead Scientist, pioneering photonic devices and solid-state light engines for aerospace, biomedical, defense, and consumer applications. Dr. Khizar holds a Ph.D. and completed postdoctoral research in Optical Sciences and Engineering from the University of North Carolina, with a focused specialization in photonic architectures and reconfigurable semiconductor device platforms for high-performance optoelectronic applications. He is the inventor of more than 45 patents, author of over 100 scientific publications, and a frequent keynote speaker at global technology forums and industry symposia.
Driving innovation at the nexus of advanced manufacturing and emerging semiconductor technologies, Dr. Khizar M. Bhutta is a distinguished Innovation Director with over 15 years of experience spanning corporate R&D, high-tech manufacturing, and academic research. He has led complex, cross-sector initiatives that deliver scalable technologies, accelerate digital transformation, and strengthen industrial competitiveness.
Renowned for bridging strategic vision with deep technical execution, Dr. Khizar has consistently translated cutting-edge science into market-ready solutions advancing organizational growth and fostering innovation ecosystems across public-private partnerships. His core expertise includes innovation engineering, new product development, high-volume manufacturing, and large-scale program leadership. As Manufacturing and Apprenticeship Solution Program Leader at Kinexus Group, Dr. Bhutta drives Industry 4.0 integration by aligning emerging digital technologies with modern manufacturing practices. In collaboration with the Michigan Manufacturing Technology Center, Tooling U-SME, and Nanoridge Materials, he leads national efforts to expand smart manufacturing adoption and cultivate a sustainable semiconductor talent pipeline through innovative apprenticeship models. Dr. Khizar’s technical portfolio spans tactile and disruptive innovation, additive manufacturing, intellectual property strategy, and consumer-driven product design. He partners closely with C-suite leadership to convert complex capabilities into measurable business value. His innovations include micro- and nanoelectronic semiconductor devices, silicon photonics, wide bandgap semiconductors for AI-integrated sensing, functional nanomaterials, cold plasma therapeutics, and circular economy solutions for advanced manufacturing.
Earlier in his career, he launched several high-impact R&D programs, including the development of a high-purity germanium detector research facility at the University of South Dakota in partnership with The Sanford Underground Research Facility, and The Lawrence Berkeley National Laboratory, CA. He also served as Research Professor at the Center for Optoelectronics and Optical Communications at UNC Charlotte, and began his career in Silicon Valley as Lead Scientist, pioneering photonic devices and solid-state light engines for aerospace, biomedical, defense, and consumer applications. Dr. Khizar holds a Ph.D. and completed postdoctoral research in Optical Sciences and Engineering from the University of North Carolina, with a focused specialization in photonic architectures and reconfigurable semiconductor device platforms for high-performance optoelectronic applications. He is the inventor of more than 45 patents, author of over 100 scientific publications, and a frequent keynote speaker at global technology forums and industry symposia.
invited speakers:
Dr. Ahmed S Khan
Professor of Electrical Engineering, Fulbright Specialist Scholar
Ex. Dean of the College of Engineering & Information Sciences
DeVry University, Addison, Illinois, USA
Title: Artificial Intelligence (AI) and the Fourth Industrial Revolution (4IR): Exploring Social and Ethical Implications
Dr. Uvais Qidwai
Associate Professor of Computer Engineering
Qatar University, Qatar
Title: Securing the Edge: An AI-Driven Detection of Intrinsic Cyber Threats via Current-Profiling in IoT Networks
Dr. M. A. Gondal
Professor of Physics
King Fahd University of Petroleum & Minerals (KFUPM), Dhahran, Saudi Arabia
Title: Shaping a Sustainable Future: Harnessing Laser-Driven Synthesis of Advanced Materials for Renewable Energy Generation, Energy Storage, and Green Hydrogen
Dr. Junaid Zubairi
Prof., SUNY Fredonia, NY USA
Title: Digital Twin for the Manhattan Grid: A Simulation Framework for Traffic Management Research